New IBM and Samsung transistors could be key to super-efficient vertical chips
IBM and Samsung claim they’ve made a breakthrough in semiconductor design. On day one of the IEDM conference in San Francisco, the two companies unveiled a new design for stacking transistors vertically on a chip. With current processors and SoCs, transistors lie flat on the surface of the silicon, and then electric current flows from Read more about New IBM and Samsung transistors could be key to super-efficient vertical chips[…]